ITEMS項目 |
A |
B |
Flux
Content(%)
助焊劑含量 |
1.4/2.2 |
Dryness
of Flux Residue
助焊劑殘渣的干燥性 |
Sprinkled
chalk poweder can easily be removed
容易清除飛散的粉末 |
Chloride
Content in Flux (%)
助焊劑中的氯含量 |
0.25/0.45% |
0.55/0.85% |
Copper
Plate Corrosion Test
銅板腐蝕試驗 |
No
Corrosion
沒有腐蝕 |
Insulation
Resistance of Flux(Ω)
助焊劑的絕緣抵抗性 |
Min
1.0×1011
1.0×1011以上 |
Min 1.0×1010
1.0×1010以上 |
Spread
Factor(%)
擴散率
Sn 60% 1.6mmØ
240℃
30sec |
on
oxidized copper plate
氧化處理銅板 |
more
than 85%
85%以上 |
more
than 90%
90%以上 |
on brass
plate
黃銅板 |
more
than 75%
75%以上 |
more
than 80%
80%以上 |
on
nickel plate
鎳板 |
more
than 60%
60%以上 |
more
than 65%
65%以上 |
Tone
of Flux after Soldering
助焊劑在焊接后的色調 |
light
yellow (transparency)
淡黃色(透明) |
Smell
氣味 |
very
low
極淡 |